HIGH PERFORMANCE: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
FOUR PITCHES: Universal BGA reballing stencils have three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
WIDE APPLICATIONS: Universal BGA reballing stencils are versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
PREMIUM MATERIAL: This universal Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.
CONVENIENT TO USE: Universal BGA stencil template has a compact appearance and is easy to carry around and use.
